发明申请
- 专利标题: COMPONENT MOUNTING APPARATUS
- 专利标题(中): 组件安装设备
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申请号: US13159971申请日: 2011-06-14
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公开(公告)号: US20120020765A1公开(公告)日: 2012-01-26
- 发明人: Hideya KURODA , Yoshihiro Yasui , Takayoshi Kawai , Hiroyuki Haneda
- 申请人: Hideya KURODA , Yoshihiro Yasui , Takayoshi Kawai , Hiroyuki Haneda
- 申请人地址: JP Chiryu-shi
- 专利权人: Fuji Machine Mfg. Co., Ltd.
- 当前专利权人: Fuji Machine Mfg. Co., Ltd.
- 当前专利权人地址: JP Chiryu-shi
- 优先权: JP2010-166661 20100726
- 主分类号: B65G47/90
- IPC分类号: B65G47/90
摘要:
In a component mounting apparatus, when one of first and second board transfer devices is performing the unloading and loading of boards, a controller operates a component placing device to mount components on a first or second board loaded by the other board transfer device. Thus, it is possible to effectively utilize the time which is taken for the unloading and the loading of either boards, for component mountings on the other board, so that the efficiency in producing boards can be enhanced. Further, since the controller executes a control so that while component mountings are performed on the first boards of M-sheets on the first board transfer device, component mountings are performed on the second boards of N-sheets on the second board transfer device, it is realized to suppress the occurrence of an intermediate stock of either boards where the first boards of the M-sheets and the second boards of the N-sheets are required.
公开/授权文献
- US08584350B2 Component mounting apparatus 公开/授权日:2013-11-19
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