Invention Application
- Patent Title: METHOD FOR MANUFACTURING THERMALLY-ASSISTED MAGNETIC RECORDING HEAD COMPRISING LIGHT SOURCE UNIT AND SLIDER
- Patent Title (中): 用于制造包含光源单元和滑块的热辅助磁记录头的方法
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Application No.: US12899101Application Date: 2010-10-06
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Publication No.: US20110228650A1Publication Date: 2011-09-22
- Inventor: Koji SHIMAZAWA , Yoshihiro TSUCHIYA , Seiichi TAKAYAMA , Nobuyuki MORI , Yasuhiro ITO , Kosuke TANAKA , Osamu SHINDO , Ryuji FUJII , Takashi HONDA , Yoshitaka SASAKI
- Applicant: Koji SHIMAZAWA , Yoshihiro TSUCHIYA , Seiichi TAKAYAMA , Nobuyuki MORI , Yasuhiro ITO , Kosuke TANAKA , Osamu SHINDO , Ryuji FUJII , Takashi HONDA , Yoshitaka SASAKI
- Applicant Address: JP Tokyo US CA Milpitas
- Assignee: TDK Corporation,Headway Technologies, Inc.
- Current Assignee: TDK Corporation,Headway Technologies, Inc.
- Current Assignee Address: JP Tokyo US CA Milpitas
- Main IPC: G11B11/00
- IPC: G11B11/00 ; B23K1/005

Abstract:
A method for manufacturing a thermally-assisted magnetic recording head is provided, in which a light source unit including a light source and a slider including an optical system are bonded. A unit substrate is made of a material transmitting light having a predetermined wavelength, and a unit adhesion material layer that contains Sn, Sn alloy, Pb alloy or Bi alloy is formed on the light source unit and/or the slider. The manufacturing method includes: aligning the light source unit and the slider in such a way that a light from the light source can enter the optical system and the unit adhesion material layer is sandwiched therebetween; and causing a light including the predetermined wavelength to enter the unit substrate to melt the unit adhesion material layer. The unit adhesion material layer melted by the light including the predetermined wavelength can ensure high alignment accuracy as well as higher bonding strength and less change with time.
Public/Granted literature
- US08248897B2 Method for manufacturing thermally-assisted magnetic recording head comprising light source unit and slider Public/Granted day:2012-08-21
Information query
IPC分类: