Invention Application
US20110159680A1 METHOD OF FORMING A DIELECTRIC LAYER AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
审中-公开
形成介质层的方法和使用该半导体器件制造半导体器件的方法
- Patent Title: METHOD OF FORMING A DIELECTRIC LAYER AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
- Patent Title (中): 形成介质层的方法和使用该半导体器件制造半导体器件的方法
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Application No.: US12975071Application Date: 2010-12-21
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Publication No.: US20110159680A1Publication Date: 2011-06-30
- Inventor: Dong-Chul YOO , Byong-Ju KIM , Han-Mei CHOI , Ki-Hyun HWANG
- Applicant: Dong-Chul YOO , Byong-Ju KIM , Han-Mei CHOI , Ki-Hyun HWANG
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Priority: KR10-2009-0135106 20091231
- Main IPC: H01L21/28
- IPC: H01L21/28 ; B05D5/12

Abstract:
In a method of forming an aluminum oxide layer, an aluminum source gas and a dilution gas can be supplied into a chamber through a common gas supply nozzle so that the aluminum source gas may be adsorbed on a substrate in the chamber. A first purge gas can be supplied into the chamber to purge the physically adsorbed aluminum source gas from the substrate. An oxygen source gas may be supplied into the chamber to form an aluminum oxide layer on the substrate. A second purge gas may be supplied into the chamber to purge a reaction residue and the physically adsorbed remaining gas from the substrate. The operations can be performed repeatedly to form an aluminum oxide layer having a desired thickness.
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