发明申请
- 专利标题: LASER PROCESSING APPARATUS AND PROCESSING METHOD EMPLOYED THEREIN
- 专利标题(中): 激光加工设备及其加工方法
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申请号: US13054459申请日: 2009-06-18
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公开(公告)号: US20110155709A1公开(公告)日: 2011-06-30
- 发明人: Eiichiro Yamada , Akira Inoue , Koji Nakazato , Hiroshi Kohda , Hitoshi Hatayama , Takemi Hasegawa
- 申请人: Eiichiro Yamada , Akira Inoue , Koji Nakazato , Hiroshi Kohda , Hitoshi Hatayama , Takemi Hasegawa
- 申请人地址: JP Osaka-shi
- 专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人地址: JP Osaka-shi
- 优先权: JP2008-185175 20080716
- 国际申请: PCT/JP2009/061110 WO 20090618
- 主分类号: B23K26/00
- IPC分类号: B23K26/00
摘要:
A laser processing apparatus 1 includes a processing light source 3 emitting processing light; an observation light emitting unit 4 emitting observation light; optical fibers 19 conducting light having a plurality of wavelengths generated at an electronic component 2; a detecting unit 5 detecting the light conducted by the optical fibers 19; and a control unit 31 controlling a light emitting state of the processing light emitting unit 3. The optical fibers 19 are categorized into four groups, and disposed so as to surround an optical fiber 18 conducting the processing light. The optical fibers 19 categorized into the four groups are capable of conducting the observation light to the electronic component 2 every group.
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