发明申请
- 专利标题: METHOD FOR FORMING PATTERNED LAYER ON SUBSTRATE STRUCTURE
- 专利标题(中): 在基板结构上形成图案的方法
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申请号: US13040476申请日: 2011-03-04
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公开(公告)号: US20110146905A1公开(公告)日: 2011-06-23
- 发明人: CHING-YU CHOU , YEN-HUEY HSU , WEI-YUAN CHEN
- 申请人: CHING-YU CHOU , YEN-HUEY HSU , WEI-YUAN CHEN
- 申请人地址: TW Tu-Cheng
- 专利权人: HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人: HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址: TW Tu-Cheng
- 优先权: TW95101345 20060113
- 主分类号: B32B38/10
- IPC分类号: B32B38/10 ; B05D5/00 ; B05D1/36 ; B05D1/38 ; B05D3/12 ; B32B37/02 ; B05D3/06
摘要:
A method for forming a patterned layer on the substrate structure, comprising the steps of providing a substrate structure, a plurality of banks formed on the substrate, the banks and the substrate cooperatively defining a plurality of accommodating rooms, jetting ink into the accommodating rooms using an ink jet device, and solidifying the ink in the accommodating rooms to form the patterned layer on the substrate structure.
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