Invention Application
- Patent Title: Insert molding method and insert molded product
- Patent Title (中): 嵌入成型法和嵌入成型品
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Application No.: US12926639Application Date: 2010-12-01
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Publication No.: US20110143111A1Publication Date: 2011-06-16
- Inventor: Satoshi YAMAMOTO , Akihiro TANBA , Masafumi KAGA
- Applicant: Satoshi YAMAMOTO , Akihiro TANBA , Masafumi KAGA
- Applicant Address: JP Tokyo
- Assignee: Hitachi Cable, Ltd.
- Current Assignee: Hitachi Cable, Ltd.
- Current Assignee Address: JP Tokyo
- Priority: JP2009-285468 20091216
- Main IPC: B32B27/34
- IPC: B32B27/34 ; B29C45/14 ; B32B27/38

Abstract:
An insert molding method includes holding a plurality of insert members in a molding die to be separated from one another, and subsequently filling a resin into the molding die to fill a gap between the insert members and a periphery thereof with the resin to form an insert molded product such that the insert members are separated at a preset interval from one another. The molding die includes a space-maintaining projection for maintaining a separation interval between the insert members at the preset interval or more, the projection being formed on an inner wall surface of the molding die opposite to a longitudinal end of the insert members, and a gate for filling the resin therethrough into the molding die, the gate being formed on an inner wall surface of the molding die opposite to a side of the insert members in a width direction thereof.
Public/Granted literature
- US08540917B2 Insert molding method and insert molded product Public/Granted day:2013-09-24
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