发明申请
- 专利标题： RELIABLE INTERCONNECTS
- 专利标题（中）： 可靠的互联
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申请号： US12860946申请日： 2010-08-23
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公开(公告)号： US20100314774A1公开(公告)日： 2010-12-16
- 发明人: Bei Chao ZHANG , Chim Seng SEET , Juan Boon TAN , Fan ZHANG , Yong Chiang EE , Bo TAO , Tong Qing CHEN , Liang Choo HSIA
- 申请人： Bei Chao ZHANG , Chim Seng SEET , Juan Boon TAN , Fan ZHANG , Yong Chiang EE , Bo TAO , Tong Qing CHEN , Liang Choo HSIA
- 申请人地址： SG Singapore
- 专利权人： GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- 当前专利权人： GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- 当前专利权人地址： SG Singapore
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A method for forming a semiconductor device is presented. The method includes providing a substrate prepared with a dielectric layer formed thereon. The dielectric layer having a conductive line disposed in an upper portion of the dielectric layer. The substrate is processed to produce a top surface of the dielectric layer that is not coplanar with a top surface of the conductive line to form a stepped topography.
公开/授权文献
- US08102054B2 Reliable interconnects 公开/授权日：2012-01-24
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