发明申请
US20100308475A1 COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATES AND A PRODUCTION METHOD
审中-公开
至少两个半导体基板的复合材料和生产方法
- 专利标题： COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATES AND A PRODUCTION METHOD
- 专利标题（中）： 至少两个半导体基板的复合材料和生产方法
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申请号： US12733861申请日： 2008-09-02
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公开(公告)号： US20100308475A1公开(公告)日： 2010-12-09
- 发明人: Achim Trautmann , Ando Feyh
- 申请人： Achim Trautmann , Ando Feyh
- 优先权： DE102007048332.7 20071009
- 国际申请： PCT/EP2008/061548 WO 20080902
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/768
摘要：
A composite, including a first semiconductor substrate that is secured by soldering material to at least one second semiconductor substrate, a eutectic being formed between the soldering material and the second semiconductor substrate and/or at least one layer possibly provided on the semiconductor substrate. It is provided that the eutectic is formed between the soldering material and a microstructure, which is formed in the region of contact with the soldering material on the second semiconductor substrate and/or the layer. Also described is a production method.
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