发明申请
- 专利标题： Lead-free tin alloy electroplating compositions and methods
- 专利标题（中）： 无铅锡合金电镀组合物及方法
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申请号： US12655554申请日： 2009-12-31
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公开(公告)号： US20100216302A1公开(公告)日： 2010-08-26
- 发明人: Yu Luo , Neil D. Brown , Michael P. Toben
- 申请人： Yu Luo , Neil D. Brown , Michael P. Toben
- 申请人地址： US MA Marlborough
- 专利权人： Rohm and Haas Electronics Materials LLC
- 当前专利权人： Rohm and Haas Electronics Materials LLC
- 当前专利权人地址： US MA Marlborough
- 主分类号： H01L21/768
- IPC分类号： H01L21/768 ; C25D3/60 ; C25D7/12
摘要：
Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, a flavone compound and a dihydroxy bis-sulfide. The electrolyte compositions are free of lead and cyanide. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.
公开/授权文献
- US07968444B2 Lead-free tin alloy electroplating compositions and methods 公开/授权日：2011-06-28
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