Invention Application
- Patent Title: PHASE CHANGE MEMORY DEVICE AND FABRICATION THEREOF
- Patent Title (中): 相变存储器件及其制造方法
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Application No.: US12468699Application Date: 2009-05-19
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Publication No.: US20100213432A1Publication Date: 2010-08-26
- Inventor: Jen-Chi Chuang , Ming-Jeng Huang , Chien-Min Lee , Jia-Yo Lin , Min-Chih Wang
- Applicant: Jen-Chi Chuang , Ming-Jeng Huang , Chien-Min Lee , Jia-Yo Lin , Min-Chih Wang
- Applicant Address: TW Hsinchu TW Hsin-Chu TW Taoyuan TW Hsinchu TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE,POWERCHIP SEMICONDUCTOR CORP.,NANYA TECHNOLOGY CORPORATION,PROMOS TECHNOLOGIES INC.,WINBOND ELECTRONICS CORP.
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE,POWERCHIP SEMICONDUCTOR CORP.,NANYA TECHNOLOGY CORPORATION,PROMOS TECHNOLOGIES INC.,WINBOND ELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu TW Hsin-Chu TW Taoyuan TW Hsinchu TW Hsinchu
- Priority: TWTW98105420 20090220
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
A method for forming a phase change memory device is disclosed. A substrate with a bottom electrode thereon is provided. A heating electrode and a dielectric layer are formed on the bottom electrode, wherein the heating electrode is surrounded by the dielectric layer. The heating electrode is etched to form recess in the dielectric layer. A phase change material is deposited on the dielectric layer, filling into the recess. The phase change material is polished to remove a portion of the phase change material exceeding the surface of the dielectric layer and a phase change layer is formed confined in the recess of the dielectric layer. A top electrode is formed on the phase change layer and the dielectric layer.
Information query
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