Invention Application
US20100213432A1 PHASE CHANGE MEMORY DEVICE AND FABRICATION THEREOF 审中-公开
相变存储器件及其制造方法

PHASE CHANGE MEMORY DEVICE AND FABRICATION THEREOF
Abstract:
A method for forming a phase change memory device is disclosed. A substrate with a bottom electrode thereon is provided. A heating electrode and a dielectric layer are formed on the bottom electrode, wherein the heating electrode is surrounded by the dielectric layer. The heating electrode is etched to form recess in the dielectric layer. A phase change material is deposited on the dielectric layer, filling into the recess. The phase change material is polished to remove a portion of the phase change material exceeding the surface of the dielectric layer and a phase change layer is formed confined in the recess of the dielectric layer. A top electrode is formed on the phase change layer and the dielectric layer.
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