Invention Application
- Patent Title: SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE ELEMENT
- Patent Title (中): 包括导电元件的半导体器件
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Application No.: US12389103Application Date: 2009-02-19
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Publication No.: US20100207272A1Publication Date: 2010-08-19
- Inventor: Rainer Steiner , Jens Pohl , Werner Robl , Markus Brunnbauer , Gottfried Beer
- Applicant: Rainer Steiner , Jens Pohl , Werner Robl , Markus Brunnbauer , Gottfried Beer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/768
Abstract:
A semiconductor device includes a chip comprising a contact element, a structured dielectric layer over the chip, and a conductive element coupled to the contact element. The conductive element comprises a first portion embedded in the structured dielectric layer, a second portion at least partially spaced apart from the first portion and embedded in the structured dielectric layer, and a third portion contacting a top of the structured dielectric layer and extending at least vertically over the first portion and the second portion.
Public/Granted literature
- US08072071B2 Semiconductor device including conductive element Public/Granted day:2011-12-06
Information query
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