发明申请
- 专利标题: CUTTING TOOL
- 专利标题(中): 切割用具
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申请号: US12598175申请日: 2009-03-25
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公开(公告)号: US20100129168A1公开(公告)日: 2010-05-27
- 发明人: Masahiro Waki , Tatsuyuki Nakaoka , Shuichi Tateno , Takashi Watanabe , Kenji Noda , Takahiko Makino
- 申请人: Masahiro Waki , Tatsuyuki Nakaoka , Shuichi Tateno , Takashi Watanabe , Kenji Noda , Takahiko Makino
- 申请人地址: JP Kyoto-shi
- 专利权人: Kyocera Corporation
- 当前专利权人: Kyocera Corporation
- 当前专利权人地址: JP Kyoto-shi
- 优先权: JP2008-080823 20080326; JP2008-326977 20081224; JP2008-326982 20081224; JP2008-016261 20090128
- 国际申请: PCT/JP2009/055990 WO 20090325
- 主分类号: B23B27/14
- IPC分类号: B23B27/14
摘要:
An object of embodiments according to the invention is to provide a cutting tool having good wear resistance, good sliding property and good fracture resistance.A cutting tool 1 comprising a substrate 2 and a coating layer 6 or a coating layer 9 which covers a surface of the substrate 2. The coating layer 6 or the coating layer 9 comprising a first layer 7 and a second layer 8. The first layer 7 comprises Ti1-a-b-c-dAlaWbSicMd(C1-xNx) when M is at least one selected from Nb, Mo, Hf and Y, 0.45≦a≦0.55, 0.01≦b≦0.1, 0≦c≦0.05, 0.01≦d≦0.1, 0≦x≦1). The second layer 8 comprises Ti1-e-f-gAleSifM′g(C1-yNy) when M′ is at least one selected from Nb, Mo, Ta, Hf and Y, 0.50≦e≦0.60, 0≦f≦0.1, 0.05≦g≦0.15, 0≦y≦1).
公开/授权文献
- US08236411B2 Cutting tool 公开/授权日:2012-08-07
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