Processes for high speed machining of workpiece materials using high performance tools with prolonged tool life and improved surface finish are provided by vibrating the tool and/or the workpiece at a frequency greater than the frequency of shear localization in the primary shear zone or chip segmentation occurring in the absence of tool vibration, with an amplitude sufficient to break up the tool-chip atomic contact, thereby decreasing the tool-chip contact length through decreasing the tool-chip contact time, thereby suppressing accelerated chemical tool wear caused by dissolution of the tool into the workpiece by nanocrystalline grain boundary diffusion and grain boundary sliding mechanisms by preventing shear localization associated with nanocrystalline grain formation in the primary shear zone of the chip, and suppressing oxidation wear of the tool by preventing segmentation of the chip.