发明申请
- 专利标题： INPUT/OUTPUT PACKAGE ARCHITECTURES, AND METHODS OF USING SAME
- 专利标题（中）： 输入/输出包装结构及其使用方法
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申请号： US12286212申请日： 2008-09-29
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公开(公告)号： US20100078781A1公开(公告)日： 2010-04-01
- 发明人: Sanka Ganesan , Kemal Aygun , Chandrashekhar Ramaswamy , Eric Palmer , Henning Braunisch
- 申请人： Sanka Ganesan , Kemal Aygun , Chandrashekhar Ramaswamy , Eric Palmer , Henning Braunisch
- 主分类号： H01L23/50
- IPC分类号： H01L23/50 ; H01L21/60
摘要：
A high-speed I/O trace is part of an I/O package architecture for an integrated circuit package substrate. The integrated circuit package substrate includes an integrated heat spreader footprint on a die-side and the I/O trace to couple with an IC device to be disposed inside the IHS footprint. The I/O trace includes a pin-out terminal outside the IHS footprint to couple to an IC device to be disposed outside the IHS footprint. The high-speed I/O trace can sustain a data flow rate from a processor in a range from 5 gigabits per second (Gb/s) to 40 Gb/s.
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