发明申请
US20100051319A1 CONTROLLING THE POROSITY OF METAL PASTES FOR PRESSURE FREE, LOW TEMPERATURE SINTERING PROCESS
审中-公开
控制无压力,低温烧结工艺的金属浆料的孔隙度
- 专利标题: CONTROLLING THE POROSITY OF METAL PASTES FOR PRESSURE FREE, LOW TEMPERATURE SINTERING PROCESS
- 专利标题(中): 控制无压力,低温烧结工艺的金属浆料的孔隙度
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申请号: US12548039申请日: 2009-08-26
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公开(公告)号: US20100051319A1公开(公告)日: 2010-03-04
- 发明人: Wolfgang SCHMITT , Michael SCHÄFER , Hans-Werner HAGEDORN
- 申请人: Wolfgang SCHMITT , Michael SCHÄFER , Hans-Werner HAGEDORN
- 申请人地址: DE Hanau
- 专利权人: W.C. HERAEUS GMBH
- 当前专利权人: W.C. HERAEUS GMBH
- 当前专利权人地址: DE Hanau
- 优先权: DE102008039828.4 20080827
- 主分类号: H01B5/00
- IPC分类号: H01B5/00 ; C09D7/12 ; H01R43/02
摘要:
Metal pastes and methods make it possible to produce extremely compact layers between contact surfaces of structural components, which layers are sufficiently elastic to permanently withstand mechanical and thermal stress variations. This is achieved by the porosity of a corresponding contact area being controlled. For this purpose, a metal paste is provided which contains 70-90% by weight of a metal powder, 1-20% by weight of an endothermically decomposable metal compound and 5-20% by weight of a solvent having a boiling point or range above 220° C., the metal paste being compactable exothermically to form a metal contact.
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