发明申请
- 专利标题： Method of fabricating multilayer printed circuit board
- 专利标题（中）： 制造多层印刷电路板的方法
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申请号： US12588259申请日： 2009-10-08
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公开(公告)号： US20100024212A1公开(公告)日： 2010-02-04
- 发明人: Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
- 申请人： Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
- 申请人地址： KR Suwon
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2007-0088346 20070831; KR10-2007-0088347 20070831
- 主分类号： H05K3/06
- IPC分类号： H05K3/06 ; H05K3/36 ; H05K3/42
摘要：
A method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.
信息查询
