发明申请
- 专利标题: Composite Panel Assembly
- 专利标题(中): 复合面板组件
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申请号: US12271179申请日: 2008-11-14
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公开(公告)号: US20100011695A1公开(公告)日: 2010-01-21
- 发明人: Hsien-Te Cheng , Hsien-Sung Cheng
- 申请人: Hsien-Te Cheng , Hsien-Sung Cheng
- 申请人地址: TW Kuei-Jen Hsiang
- 专利权人: Xxentria Technology Materials Co., Ltd.
- 当前专利权人: Xxentria Technology Materials Co., Ltd.
- 当前专利权人地址: TW Kuei-Jen Hsiang
- 优先权: TW097126947 20080716
- 主分类号: E04C2/30
- IPC分类号: E04C2/30 ; E04B2/72
摘要:
A composite panel assembly includes: a first composite panel having first and second contact surfaces, and including upper and lower protective layers, and a first core; and a second composite panel having third and fourth contact surfaces, and including upper and lower protective layers, and a second core. The first contact surface of the first composite panel is disposed above and abuts against the third contact surface of the second composite panel, and the second contact surface of the first composite panel is disposed below and abuts against the fourth contact surface of the second composite panel.
公开/授权文献
- US08141325B2 Composite panel assembly 公开/授权日:2012-03-27
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