Invention Application
- Patent Title: INTEGRATED CIRCUIT AND PHOTONIC BOARD THEREOF
- Patent Title (中): 集成电路和光电板
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Application No.: US12142808Application Date: 2008-06-20
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Publication No.: US20090317033A1Publication Date: 2009-12-24
- Inventor: Chih-Tsung Shih , Ding-Yuan Chen , Hung-Pin Yang , Shu-Mei Yang , Shinh Chao , Yung-Jui Chen , Chien-Jen Sun
- Applicant: Chih-Tsung Shih , Ding-Yuan Chen , Hung-Pin Yang , Shu-Mei Yang , Shinh Chao , Yung-Jui Chen , Chien-Jen Sun
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Main IPC: G02B6/12
- IPC: G02B6/12
Abstract:
An integrated circuit (IC) including at least a first and a second logical blocks and a photonic board is provided. The photonic board connects with the first and the second logical blocks through a eutectic bonding technology, and communicates at least a logical signal of the first logical block to the second logical block by light conduction.
Information query
