发明申请
- 专利标题: LIGHT EMITTING DIODE SUBSTRATE MODULE AND METHOD OF MANUFACTURING THE SAME, AND BACKLIGHT UNIT AND METHOD OF MANUFACTURING THE SAME
- 专利标题(中): 发光二极管基板模块及其制造方法及背光单元及其制造方法
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申请号: US12244393申请日: 2008-10-02
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公开(公告)号: US20090161343A1公开(公告)日: 2009-06-25
- 发明人: Jung Kyu PARK , Seong Ah Joo , Seung Hwan Choi
- 申请人: Jung Kyu PARK , Seong Ah Joo , Seung Hwan Choi
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权: KR10-2007-0136264 20071224
- 主分类号: G09F13/08
- IPC分类号: G09F13/08 ; H01L33/00 ; F21V7/00 ; H01J9/00 ; B05D5/00
摘要:
There are provided a light emitting diode substrate module and a method of manufacturing the same, and a backlight unit and a method of manufacturing the same. A light emitting diode substrate module according to an aspect of the invention includes: a metal plate; an insulating film having a predetermined thickness and provided on an entire outer surface of the metal plate; a reflective film having a predetermined thickness and provided on an entire outer surface of the insulating film; and at least one light emitting diode package electrically connected to a driving circuit provided on the reflective film by pattern printing.Unnecessary material costs can be avoided by forming a predetermined driving circuit by pattern printing, and optical characteristics can be improved by stably maintaining reflection characteristics.
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