Invention Application
- Patent Title: Apparatus and Method for Wafer Edge Defects Detection
- Patent Title (中): 晶圆边缘缺陷检测装置及方法
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Application No.: US12188849Application Date: 2008-08-08
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Publication No.: US20090116727A1Publication Date: 2009-05-07
- Inventor: Ju Jin , Satish Sadam , Vishal Verma , Zhiyan Huang , Siming Lin , Michael D. Robbins , Paul F. Forderhase
- Applicant: Ju Jin , Satish Sadam , Vishal Verma , Zhiyan Huang , Siming Lin , Michael D. Robbins , Paul F. Forderhase
- Applicant Address: US MI Bloomfield Hills
- Assignee: Accretech USA, Inc.
- Current Assignee: Accretech USA, Inc.
- Current Assignee Address: US MI Bloomfield Hills
- Main IPC: G06K9/00
- IPC: G06K9/00
Abstract:
A substrate illumination and inspection system provides for illuminating and inspecting a substrate particularly the substrate edge. The system a image processor to automatically detect and characterize defects on the wafer's edge.
Public/Granted literature
- US2575413A Soldering flux Public/Granted day:1951-11-20
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