Invention Application
US20090045889A1 High-speed router with backplane using muli-diameter drilled thru-holes and vias
有权
具有背板的高速路由器使用多孔直径钻孔和通孔
- Patent Title: High-speed router with backplane using muli-diameter drilled thru-holes and vias
- Patent Title (中): 具有背板的高速路由器使用多孔直径钻孔和通孔
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Application No.: US11891785Application Date: 2007-08-13
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Publication No.: US20090045889A1Publication Date: 2009-02-19
- Inventor: Joel R. Goergen , Greg Hunt
- Applicant: Joel R. Goergen , Greg Hunt
- Applicant Address: US CA San Jose
- Assignee: Force 10 Networks, Inc.
- Current Assignee: Force 10 Networks, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H01K3/00 ; H05K1/11

Abstract:
A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru-holes are used to connect the differential signal pairs to external components. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. At least some of the thru-holes and vias are drilled to reduce an electrically conductive stub length portion of the hole. The drilled portion of a hole includes a transition from a first profile to a second profile to reduce radio frequency reflections from the end of the drilled hole.
Public/Granted literature
- US08158892B2 High-speed router with backplane using muli-diameter drilled thru-holes and vias Public/Granted day:2012-04-17
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