发明申请
- 专利标题： GOLD PLATING LIQUID AND GOLD PLATING METHOD
- 专利标题（中）： 镀金液和镀金方法
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申请号： US11718471申请日： 2005-10-21
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公开(公告)号： US20090038957A1公开(公告)日： 2009-02-12
- 发明人: Toshiaki Sakakihara , Yasuhiro Kawase , Fumikazu Mizutanii , Makoto Ishikawa , Yoshihide Suzuki , Keiichi Sawai
- 申请人： Toshiaki Sakakihara , Yasuhiro Kawase , Fumikazu Mizutanii , Makoto Ishikawa , Yoshihide Suzuki , Keiichi Sawai
- 申请人地址： JP Minato-ku JP Osaka-shi
- 专利权人： MITSUBISHI CHEMICAL CORPORATION,SHARP KABUSHIKI KAISHA
- 当前专利权人： MITSUBISHI CHEMICAL CORPORATION,SHARP KABUSHIKI KAISHA
- 当前专利权人地址： JP Minato-ku JP Osaka-shi
- 优先权： JP2004-319451 20041102
- 国际申请： PCT/JP05/19404 WO 20051021
- 主分类号： C25C1/20
- IPC分类号： C25C1/20 ; C09D7/00
摘要：
In a stable gold plating liquid having a low toxicity besides properties comparable to those of a cyan-type gold plating liquid, iodine and/or iodide ions, gold ions, and a polyalcohol having at least 4 carbon atoms are contained. The polyalcohol having at least 4 carbon atoms may be diethylene glycol or triethylene glycol. The content of the polyalcohol having at least 4 carbon atoms in the gold plating liquid is generally 10 to 90 percent by weight. The gold plating liquid may contain water.
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