发明申请
US20090015278A1 APPARATUS TO MONITOR SUBSTRATE VIABILITY 审中-公开
监测基板可能性的装置

  • 专利标题: APPARATUS TO MONITOR SUBSTRATE VIABILITY
  • 专利标题(中): 监测基板可能性的装置
  • 申请号: US11776996
    申请日: 2007-07-12
  • 公开(公告)号: US20090015278A1
    公开(公告)日: 2009-01-15
  • 发明人: Hien DangSri Sri-Jayantha
  • 申请人: Hien DangSri Sri-Jayantha
  • 主分类号: G01R31/02
  • IPC分类号: G01R31/02
APPARATUS TO MONITOR SUBSTRATE VIABILITY
摘要:
An apparatus for detecting and reporting a condition is described. The apparatus is an electronic package comprising a substrate with electrically conducting lines electrically connected to an integrated chip, and to a source of voltage. The integrated circuit chip is mounted onto a substrate and electrically connected to at least one electrically conducting line. A sensor, combined with a signal generator, connected to the substrate, is operable to generate an electrical signal upon detection of a condition selected from a condition of the substrate and a condition of an electrical connection to the substrate. The signal generator, after immediately receiving the aforesaid electrical signal from the sensor, emits the warning signal. The warning signal of indicated of an existing defect or a condition which can lower the longevity of the total electronic package.
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