发明申请
- 专利标题： METAL-POLISHING LIQUID AND POLISHING METHOD
- 专利标题（中）： 金属抛光液和抛光方法
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申请号： US12055930申请日： 2008-03-26
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公开(公告)号： US20080242090A1公开(公告)日： 2008-10-02
- 发明人: Toru YAMADA , Makoto KIKUCHI , Tadashi INABA , Takahiro MATSUNO , Takamitsu TOMIGA , Kazutaka TAKAHASHI
- 申请人： Toru YAMADA , Makoto KIKUCHI , Tadashi INABA , Takahiro MATSUNO , Takamitsu TOMIGA , Kazutaka TAKAHASHI
- 申请人地址： JP Tokyo
- 专利权人： FUJIFILM CORPORATION
- 当前专利权人： FUJIFILM CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2007-095284 20070330
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; C09K13/00
摘要：
A metal-polishing liquid used for chemical-mechanical polishing of a conductor film of copper or a copper alloy in a process for manufacturing a semiconductor device, the metal-polishing liquid comprising: (1) an amino acid derivative represented by the formula (I); and (2) a surfactant, wherein, in the formula (I), R1 represents an alkyl group having 1 to 4 carbon atoms and R2 represents an alkylene group having 1 to 4 carbon atoms.
公开/授权文献
- US08083964B2 Metal-polishing liquid and polishing method 公开/授权日：2011-12-27
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