发明申请
US20080217180A1 Surface with an Anti-Adhesion Microstructure and Method for Producing Same
审中-公开
具有抗粘附微结构的表面及其制造方法
- 专利标题: Surface with an Anti-Adhesion Microstructure and Method for Producing Same
- 专利标题(中): 具有抗粘附微结构的表面及其制造方法
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申请号: US11660814申请日: 2005-08-08
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公开(公告)号: US20080217180A1公开(公告)日: 2008-09-11
- 发明人: Christian Doye , Ursus Kruger , Manuela Schneider
- 申请人: Christian Doye , Ursus Kruger , Manuela Schneider
- 申请人地址: DE MUENCHEN
- 专利权人: SIEMENS AKTIENGESELLSCHAFT
- 当前专利权人: SIEMENS AKTIENGESELLSCHAFT
- 当前专利权人地址: DE MUENCHEN
- 优先权: DE102004041813.6 20040826
- 国际申请: PCT/EP05/53902 WO 20050808
- 主分类号: C25D5/18
- IPC分类号: C25D5/18 ; C25D7/00
摘要:
The invention relates to a surface comprising a microstructure that reduces adhesion and to a method for producing said microstructure. Microstructures of this type that reduce adhesion are known and are used, for example, to configure self-cleaning surfaces that us the Lotus effect. According to the invention, the surface is produced electrochemically by means of reverse pulse plating, the known microstructure being first produced and a nanostructure that is overlaid on the microstructure is produced at the same time or in a subsequent step. To achieve this for example, the pulse length of the current pulse that is used during the reverse pulse plating lies in the millisecond range and has a pulse length ratio greater than 1:3. The microstructure that has been produced, consisting of peaks and troughs is then overlaid with peaks and troughs of a smaller size order belonging to the nanostructure.
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