A system for cooling a power source enclosure may include a power source enclosure configured to substantially enclose a power source, and a cooling package, including an airflow provider, located separately from the power source enclosure. The system may further include a conduit configured to provide a fluid connection between a section of the airflow provider and an area inside the power source enclosure, wherein the conduit includes a first end disposed near the section of the airflow provider, such that during operation of the airflow provider a pressure differential exists between the first end and a second end, and wherein the second end is disposed near and in fluid communication with an area within the power source enclosure.