Invention Application
US20080150147A1 HIGH SURFACE AREA ALUMINUM BOND PAD FOR THROUGH-WAFER CONNECTIONS TO AN ELECTRONIC PACKAGE
有权
高表面积的铝合金焊盘，用于通过电缆连接到电子包装
- Patent Title: HIGH SURFACE AREA ALUMINUM BOND PAD FOR THROUGH-WAFER CONNECTIONS TO AN ELECTRONIC PACKAGE
- Patent Title (中): 高表面积的铝合金焊盘，用于通过电缆连接到电子包装
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Application No.: US12046737Application Date: 2008-03-12
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Publication No.: US20080150147A1Publication Date: 2008-06-26
- Inventor: James W. Adkisson , Jeffrey P. Gambino , Mark D. Jaffe , Richard J. Rassel , Edmund J. Sprogis
- Applicant: James W. Adkisson , Jeffrey P. Gambino , Mark D. Jaffe , Richard J. Rassel , Edmund J. Sprogis
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Main IPC: H01L23/488
- IPC: H01L23/488
Abstract:
A bond pad for effecting through-wafer connections to an integrated circuit or electronic package and method of producing thereof. The bond pad includes a high surface area aluminum bond pad in order to resultingly obtain a highly reliable, low resistance connection between bond pad and electrical leads.
Public/Granted literature
- US07964967B2 High surface area aluminum bond pad for through-wafer connections to an electronic package Public/Granted day:2011-06-21
Information query
IPC分类:
