A semiconductor element (semiconductor device) including a substrate having a patterned structure of an organic semiconductor material and a method of manufacturing the semiconductor element are disclosed. According to one embodiment, the method of manufacturing the semiconductor element provides a substrate having a patterned structure of an organic semiconductor material which is cost-effective and which realizes a structure having a high degree of uniformity of the patterned semiconductor regions. The method includes: providing the substrate, applying a continuous layer of an organic semiconductor material onto the substrate, applying a solvent onto the continuous layer in the second regions thereby dissolving and removing the organic semiconductor material, which is located in the second regions, from the continuous layer.