Invention Application
- Patent Title: Fluxless Reflow Process for Bump Formation
- Patent Title (中): 用于凸起形成的无通流回流工艺
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Application No.: US11859163Application Date: 2007-09-21
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Publication No.: US20080128476A1Publication Date: 2008-06-05
- Inventor: Tsing-Chow Wang , Runling Li
- Applicant: Tsing-Chow Wang , Runling Li
- Applicant Address: CN Shanghai
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (Shanghai) CORPORATION
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (Shanghai) CORPORATION
- Current Assignee Address: CN Shanghai
- Priority: CN200610119047.5 20061204
- Main IPC: B23K31/02
- IPC: B23K31/02
Abstract:
A fluxless reflow process for bump formation is provided, which includes: a purifying process for keeping solder in a state of melting or half-melting for 40 s to 540 s; a ball-forming process for melting the solder completely to form ball-like bumps; and a cooling process. The splashing of solder can be avoided and the defect that there may be solder balls around the bumps can be eliminated.
Public/Granted literature
- US07838411B2 Fluxless reflow process for bump formation Public/Granted day:2010-11-23
Information query
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