发明申请
- 专利标题： Apparatus and method for laser cutting
- 专利标题（中）： 激光切割的装置和方法
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申请号： US11882634申请日： 2007-08-03
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公开(公告)号： US20080116181A1公开(公告)日： 2008-05-22
- 发明人: Der-Chun Wu , De-Jiun Li
- 申请人： Der-Chun Wu , De-Jiun Li
- 优先权： TW95142674 20061117
- 主分类号： B23K26/38
- IPC分类号： B23K26/38 ; B23K26/14
摘要：
An apparatus for laser cutting having two laser sources and the method thereof are provided for the assembly substrate. An Yttrium Aluminum Garnet (YAG) laser is used to execute the cutting-off process for the positions without the terminals and the outer-edge positions of the terminals of the assembly substrate, and an Infra-Red (IR) laser is used to execute the cutting process for the inner-edge positions of the terminals of the assembly substrate. The YAG laser and the IR laser can be operated at different time or at the same time.
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