发明申请
US20080064143A1 Microelectronic Devices and Methods 有权
微电子器件与方法

Microelectronic Devices and Methods
摘要:
A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When high thermal conductivity materials are used, the body acts to transfer the heat away from the substrate to a heat sink.
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