Invention Application
- Patent Title: METHOD OF MANUFACTURING ULTRA-THIN SOFT CONDUCTIVE CLOTH
- Patent Title (中): 制造超薄软导电布的方法
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Application No.: US11850715Application Date: 2007-09-06
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Publication No.: US20080057191A1Publication Date: 2008-03-06
- Inventor: Feng-Chang Chang , Chih-Ming Cheng , Chun-Hung Lin
- Applicant: Feng-Chang Chang , Chih-Ming Cheng , Chun-Hung Lin
- Applicant Address: TW Touliu
- Assignee: Formosa Taffeta Co., Ltd.
- Current Assignee: Formosa Taffeta Co., Ltd.
- Current Assignee Address: TW Touliu
- Priority: TW095132883 20060906
- Main IPC: B05D3/12
- IPC: B05D3/12 ; B05D5/10
Abstract:
The present invention relates to a method of manufacturing an ultra-thin soft conductive cloth, which includes the steps of providing a cloth interwoven with artificial fibers, thermal calendering the cloth at least once to reduce the thickness and increase the softness, and electroless plating the thermal calendered cloth for metallization, so as to form the ultra-thin soft conductive cloth having electromagnetic shielding effect.
Information query
