Invention Application
- Patent Title: Silicon-based thin substrate and packaging schemes
- Patent Title (中): 硅基薄基板和封装方案
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Application No.: US11493375Application Date: 2006-07-26
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Publication No.: US20080023850A1Publication Date: 2008-01-31
- Inventor: Szu Wei Lu , Clinton Chao , Ann Luh , Tjandra Winata Karta , Jerry Tzou , Kuo-Chin Chang
- Applicant: Szu Wei Lu , Clinton Chao , Ann Luh , Tjandra Winata Karta , Jerry Tzou , Kuo-Chin Chang
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A silicon-based thin package substrate is used for packaging semiconductor chips. The silicon-based thin package substrate preferably has a thickness of less than about 200 μm. A plurality of through-hole vias are formed in the silicon-based thin package substrate, connecting BGA balls and solder bumps. The silicon-based thin package substrate may be used as a carrier of semiconductor chips.
Public/Granted literature
- US07804177B2 Silicon-based thin substrate and packaging schemes Public/Granted day:2010-09-28
Information query
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