Invention Application
- Patent Title: Top bond pad for transducing head interconnect
- Patent Title (中): 用于转换头互连的顶部接合垫
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Application No.: US11439047Application Date: 2006-05-23
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Publication No.: US20070274005A1Publication Date: 2007-11-29
- Inventor: Jianxin Zhu , David A. Sluzewski , Lance E. Stover , Joel W. Hoehn , Kevin J. Schulz
- Applicant: Jianxin Zhu , David A. Sluzewski , Lance E. Stover , Joel W. Hoehn , Kevin J. Schulz
- Applicant Address: US CA Scotts Valley
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Scotts Valley
- Main IPC: G11B5/60
- IPC: G11B5/60
Abstract:
A slider according to the present invention includes a slider body, a plurality of insulators, and conductive traces. The slider body has a first side and edges defined substantially perpendicular to the first side. The plurality of insulators are each adjacent to the first side of the slider body. The conductive traces are adjacent to each of the plurality of insulators and opposite the slider body.
Public/Granted literature
- US07929248B2 Top bond pad for transducing head interconnect Public/Granted day:2011-04-19
Information query
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