Invention Application
- Patent Title: Low tunneling current MIM structure and method of manufacturing same
- Patent Title (中): 低隧道电流MIM结构及其制造方法
-
Application No.: US11379478Application Date: 2006-04-20
-
Publication No.: US20070247784A1Publication Date: 2007-10-25
- Inventor: Yu-Jen Wang , Hsing-Lien Lin , Yeur-Luen Tu
- Applicant: Yu-Jen Wang , Hsing-Lien Lin , Yeur-Luen Tu
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01G4/06
- IPC: H01G4/06

Abstract:
Disclosed herein are new MIM structures having increased capacitance with little or no tunneling current, and related methods of manufacturing the same. In one embodiment, the new MIM structure comprises a first electrode comprising a magnetic metal and having a magnetic moment aligned in a first direction, and a second electrode comprising a magnetic metal and having a magnetic moment aligned in a second direction antiparallel to the first direction. In addition, such an MIM structure comprises a dielectric layer formed between the first and second electrodes and contacting the first and second magnetic metals.
Public/Granted literature
- US07529078B2 Low tunneling current MIM structure and method of manufacturing same Public/Granted day:2009-05-05
Information query