发明申请
US20070242248A1 Substrate processing method, exposure apparatus, and method for producing device
审中-公开
基板加工方法，曝光装置及其制造方法
- 专利标题： Substrate processing method, exposure apparatus, and method for producing device
- 专利标题（中）： 基板加工方法，曝光装置及其制造方法
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申请号： US11808349申请日： 2007-06-08
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公开(公告)号： US20070242248A1公开(公告)日： 2007-10-18
- 发明人: Katsushi Nakano , Masahiko Okumura , Tarou Sugihara , Takeyuki Mizutani , Tomoharu Fujiwara
- 申请人： Katsushi Nakano , Masahiko Okumura , Tarou Sugihara , Takeyuki Mizutani , Tomoharu Fujiwara
- 申请人地址： JP TOKYO
- 专利权人： NIKON CORPORATION
- 当前专利权人： NIKON CORPORATION
- 当前专利权人地址： JP TOKYO
- 优先权： JP2004-310993 20041026
- 主分类号： G03B27/42
- IPC分类号： G03B27/42
摘要：
A device manufacturing method includes applying, in a lithographic apparatus, a prewetting liquid on top of a layer of radiation sensitive material of a substrate, on a substrate table, or on both; providing an immersion liquid for use in projecting a patterned beam of radiation on the prewet substrate and/or substrate table; and projecting a patterned beam of radiation, through the immersion liquid, onto the substrate and/or the substrate table.
公开/授权文献
- US2690692A Lathe with chip-breaking mechanism 公开/授权日：1954-10-05
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