发明申请
US20070175878A1 Floor heating system 有权
地暖系统

  • 专利标题: Floor heating system
  • 专利标题(中): 地暖系统
  • 申请号: US11343782
    申请日: 2006-01-31
  • 公开(公告)号: US20070175878A1
    公开(公告)日: 2007-08-02
  • 发明人: Thaddeus Jones
  • 申请人: Thaddeus Jones
  • 主分类号: H05B3/00
  • IPC分类号: H05B3/00
Floor heating system
摘要:
A floor heating system including a sub-floor, a plurality of fasteners, a first heater conductor assembly and a second heater conductor assembly. The first conductor assembly including a first resistive conductor having a first length, first and second ends, and two low resistance conductors. The two low resistance conductors being respectively connected to each of the first and second ends. The second heater conductor assembly including a second resistive conductor having a second length, first and second ends, and two low resistance conductors. The two low resistance conductors being respectively connected to each of the first and second ends of the second resistive conductor. The low resistance conductor that is connected to the first end of the first resistive conductor being connected in a serial fashion to the low resistance conductor that is connected to the first end of the second resistive conductor. The first length being approximately a first integer multiple of the second length. The first resistive conductor and the second resistive conductor having substantially the same resistivity per unit of length. The plurality of fasteners connecting the first heater conductor assembly and the second heater conductor assembly to the sub-floor.
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