发明申请
- 专利标题: Microcontact printed thin film capacitors
- 专利标题(中): 微接触式薄膜电容器
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申请号: US11262524申请日: 2005-10-28
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公开(公告)号: US20070172592A1公开(公告)日: 2007-07-26
- 发明人: Susan Trolier-McKinstry , Clive Randall , Hajime Nagata , Pascal Pinceloup , James Beeson , Daniel Skamser , Michael Randall , Azizuddin Tajuddin
- 申请人: Susan Trolier-McKinstry , Clive Randall , Hajime Nagata , Pascal Pinceloup , James Beeson , Daniel Skamser , Michael Randall , Azizuddin Tajuddin
- 申请人地址: US PA University Park
- 专利权人: The Penn State Research Foundation,Kemet Corporation
- 当前专利权人: The Penn State Research Foundation,Kemet Corporation
- 当前专利权人地址: US PA University Park
- 主分类号: B05D5/00
- IPC分类号: B05D5/00 ; B05D3/08
摘要:
The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO3 multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO3 dielectric layers and LaNiO3 internal electrodes are prepared, enabling dielectric layer thicknesses of 1 μm or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.
公开/授权文献
- US08414962B2 Microcontact printed thin film capacitors 公开/授权日:2013-04-09
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