发明申请
- 专利标题: THREE-DIMENSIONAL IMAGING USING ELECTRON BEAM ACTIVATED CHEMICAL ETCH
- 专利标题(中): 使用电子束激活化学蚀刻的三维成像
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申请号: US11622758申请日: 2007-01-12
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公开(公告)号: US20070158562A1公开(公告)日: 2007-07-12
- 发明人: MEHRAN NASSER-GHODSI , Tzu-Chin Chuang , Kenneth Krzeczowski , Matthew Lent , Chris Huang , Stanislaw Borowicz
- 申请人: MEHRAN NASSER-GHODSI , Tzu-Chin Chuang , Kenneth Krzeczowski , Matthew Lent , Chris Huang , Stanislaw Borowicz
- 申请人地址: US CA Milpitas
- 专利权人: KLA-Tencor Technologies Corporation
- 当前专利权人: KLA-Tencor Technologies Corporation
- 当前专利权人地址: US CA Milpitas
- 主分类号: G21K7/00
- IPC分类号: G21K7/00
摘要:
Methods and apparatus for imaging a structure and a related processor-readable medium are disclosed. A surface of a substrate (or a portion thereof) is exposed to a gas composition. The gas composition includes one or more components that etch the substrate upon activation by interaction with a beam of electrons. A beam of electrons is directed to one or more portions of the surface of the substrate that are exposed to the gas composition to etch the one or more portions. A plurality of images is obtained of the one or more portions at different instances of time as the one or more portions are etched. A three-dimensional model of one or more structures embedded within the one or more portions of the substrate is generated from the plurality of images.
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