发明申请
- 专利标题: MOLD ASSEMBLY
- 专利标题(中): 模具组装
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申请号: US11309304申请日: 2006-07-24
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公开(公告)号: US20070122514A1公开(公告)日: 2007-05-31
- 发明人: MING-CHIANG TSAI
- 申请人: MING-CHIANG TSAI
- 申请人地址: TW Taipei Hsien
- 专利权人: HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人: HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址: TW Taipei Hsien
- 优先权: TW94141542 20051125
- 主分类号: B29C45/26
- IPC分类号: B29C45/26 ; B29C33/30
摘要:
A mold assembly (200) is described that includes an upper mold (4), a lower mold (5) and a plurality of adjusting members (7). The upper mold includes an upper mold core (42). The lower mold includes a lower mold carrier (51) and a lower mold core (52). The lower mold carrier includes a plurality of sidewalls (511), which cooperatively define an opening (512) and have a plurality of screw holes (515) defined therethrough in communication with the receiving cavity. The lower mold core is received in the receiving cavity with a clearance formed therebetween. The adjusting member engages in the screw holes for aligning the lower mold core with the lower mold carrier.
公开/授权文献
- US07458797B2 Mold assembly 公开/授权日:2008-12-02
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