发明申请
US20070116930A1 Surface reforming method and surface reforming apparatus of thermoplastic resin, and molded product
审中-公开
表面改性法和热塑性树脂的表面改性装置及成型品
- 专利标题: Surface reforming method and surface reforming apparatus of thermoplastic resin, and molded product
- 专利标题(中): 表面改性法和热塑性树脂的表面改性装置及成型品
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申请号: US11602177申请日: 2006-11-21
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公开(公告)号: US20070116930A1公开(公告)日: 2007-05-24
- 发明人: Atsushi Yamada , Atsushi Yusa
- 申请人: Atsushi Yamada , Atsushi Yusa
- 申请人地址: JP Matsudo-shi JP Osaka
- 专利权人: SEIKOH GIKEN Co., Ltd.,HITACHI MAXELL, Ltd.
- 当前专利权人: SEIKOH GIKEN Co., Ltd.,HITACHI MAXELL, Ltd.
- 当前专利权人地址: JP Matsudo-shi JP Osaka
- 优先权: JP2005-337343 20051122
- 主分类号: B27N3/08
- IPC分类号: B27N3/08 ; B32B3/00
摘要:
To cause uniform infiltration in a thermoplastic resin surface in a short time using a small amount of a surface reforming material. A surface reforming method of a thermoplastic resin includes a step of opening a movable mold after a thermoplastic resin is molded in a cavity to form a gap between a portion of a molded product and a stationary mold, a step of introducing supercritical fluid, subcritical fluid, or high pressure gas including a surface reforming material into the gap, a step of narrowing the gap by closing the movable mold by a predetermined amount to prevent leaking of the introduced supercritical fluid, subcritical fluid, or high pressure gas from the gap, and of charging the supercritical fluid, the subcritical fluid, or the high pressure gas into a narrowed second gap, and a step of clamping and compressing the molded product.
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