Invention Application
- Patent Title: Flux system to reduce copper cracking
- Patent Title (中): 助焊剂系统减少铜裂纹
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Application No.: US11222251Application Date: 2005-09-08
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Publication No.: US20070051702A1Publication Date: 2007-03-08
- Inventor: Matthew James , Teresa Melfi
- Applicant: Matthew James , Teresa Melfi
- Assignee: Lincoln Global, Inc., a Delaware corporation
- Current Assignee: Lincoln Global, Inc., a Delaware corporation
- Main IPC: B23K9/18
- IPC: B23K9/18
Abstract:
A granular flux formulated to reduce copper cracking in a weld bead. The granular flux forms a slag during a welding process that inhibits or prevents migration of molten copper migration through the slag.
Information query
