Invention Application
- Patent Title: Molding apparatus
- Patent Title (中): 成型设备
-
Application No.: US11475182Application Date: 2006-06-27
-
Publication No.: US20070003659A1Publication Date: 2007-01-04
- Inventor: Sang-hun Lee , Jong-won Lee , Sang-bae Lee
- Applicant: Sang-hun Lee , Jong-won Lee , Sang-bae Lee
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR2005-57754 20050630
- Main IPC: B29C45/00
- IPC: B29C45/00

Abstract:
An molding apparatus includes a core having a recessed part corresponding to a protruding part of a molded article, an ejector pin movably provided in the core to eject the molded article, an ejector sleeve movably provided in the core to push the protruding part of the molded article, and an ejector actuating part to move the ejector pin and the ejector sleeve together to a separation position where the protruding part of the molded article is separated from the recessed portion of the core, to bring the ejector sleeve into a stop position so that the ejector sleeve does not protrude from the core, and to move the ejector pin from the separation position to a removal position where the molded article is spaced apart from the core by a predetermined distance. Accordingly, the molding apparatus is capable of preventing damage caused on an ejector sleeve.
Public/Granted literature
- US07597550B2 Molding apparatus having ejector sleeve and ejector pin Public/Granted day:2009-10-06
Information query