Invention Application
- Patent Title: Heat sink
- Patent Title (中): 散热器
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Application No.: US11455727Application Date: 2006-06-20
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Publication No.: US20060237167A1Publication Date: 2006-10-26
- Inventor: Yi-Sheng Lee
- Applicant: Yi-Sheng Lee
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Priority: TW93106818 20040315
- Main IPC: F28D15/00
- IPC: F28D15/00
Abstract:
A heat sink including a main body and a plurality of porous structures is disclosed. The main body has a plurality of hollow fins and a base. The fins and the base form a closed room. The porous structures are set on the interior surfaces of different fins, and are connected to the base. Each porous structure defines a vapor chamber.
Information query
