发明申请
- 专利标题： Method and apparatus for mounting electronic components
- 专利标题（中）： 用于安装电子部件的方法和装置
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申请号： US11153805申请日： 2005-06-15
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公开(公告)号： US20060112545A1公开(公告)日： 2006-06-01
- 发明人: Young-soo Hwang
- 申请人： Young-soo Hwang
- 申请人地址： KR Changwon-city
- 专利权人： Samsung Techwin Co., Ltd.
- 当前专利权人： Samsung Techwin Co., Ltd.
- 当前专利权人地址： KR Changwon-city
- 优先权： KR10-2004-0099020 20041130
- 主分类号： H05K3/30
- IPC分类号： H05K3/30 ; B23P19/00
摘要：
A method and apparatus for mounting electronic components is provided. The method comprises: rotating at least one rotation housing, and thereby correcting positions of a plurality of nozzle spindles depending on specified absorption positions of the electronic components; absorbing the electronic components by descending at least one nozzle spindle; rotating at least one rotation housing and rotating nozzle spindles to which the electronic components are absorbed, thereby correcting positions of the electronic components absorbed to the nozzle spindles depending on an inclination angle of specified positions for mounting the electronic components to a printed circuit board; moving the absorbed electronic components over the printed circuit board; and mounting the absorbed electronic components to the specified mounting positions of the printed circuit board.
公开/授权文献
- US07281323B2 Method for mounting electronic components 公开/授权日：2007-10-16
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