发明申请
- 专利标题： Calibration of thermal sensors for semiconductor dies
- 专利标题（中）： 半导体芯片热传感器校准
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申请号： US10955154申请日： 2004-09-30
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公开(公告)号： US20060066384A1公开(公告)日： 2006-03-30
- 发明人: Sandeep Jain , Animesh Mishra , Jun Shi , Pochang Hsu , David Wyatt
- 申请人： Sandeep Jain , Animesh Mishra , Jun Shi , Pochang Hsu , David Wyatt
- 主分类号： H03K17/14
- IPC分类号： H03K17/14
摘要：
A thermal management system is described which may be implemented on a semiconductor die. The system may include a thermal sensor thermally coupled to the die to sense the temperature of the die and generate an output representing the sensed temperature, and an adjustable compensation circuit coupled to the thermal sensor to compensate the thermal sensor output. The adjustable compensation circuit may be applied to the thermal sensor or to a threshold.
公开/授权文献
- US07356426B2 Calibration of thermal sensors for semiconductor dies 公开/授权日：2008-04-08
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