发明申请
- 专利标题： Packaging with metal studs formed on solder pads
- 专利标题（中）： 包装在焊盘上形成金属螺柱
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申请号： US10941586申请日： 2004-09-14
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公开(公告)号： US20060055032A1公开(公告)日： 2006-03-16
- 发明人: Kuo-Chin Chang , Kuo-Ning Chiang
- 申请人： Kuo-Chin Chang , Kuo-Ning Chiang
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor assembly has solder bumps with increased reliability. One embodiment of an assembly comprises a first substrate having at least one conductive pad on its surface; a second substrate having at least one conductive pad on its surface; at least one conductive stud; and at least one solder bump in contact with the conductive pad on the first substrate, and in contact with the conductive pad of the second substrate, and formed around the at least one conductive stud. Methods for providing these assemblies are included.
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