Invention Application
US20050269674A1 Semiconductor equipment having multiple semiconductor devices and multiple lead frames
有权
具有多个半导体器件和多个引线框架的半导体设备
- Patent Title: Semiconductor equipment having multiple semiconductor devices and multiple lead frames
- Patent Title (中): 具有多个半导体器件和多个引线框架的半导体设备
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Application No.: US11142346Application Date: 2005-06-02
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Publication No.: US20050269674A1Publication Date: 2005-12-08
- Inventor: Haruo Kawakita , Koji Ando
- Applicant: Haruo Kawakita , Koji Ando
- Applicant Address: JP Aichi-pref
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Aichi-pref
- Priority: JP2004-165946 20040603; JP2005-112512 20050408
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/495
Abstract:
Semiconductor equipment includes: a first lead frame having a first semiconductor device; a second lead frame having a second semiconductor device; a thermal resistor for preventing heat transfer from the first lead frame to the second lead frame; and a temperature sensitive device for detecting operational temperature of the first semiconductor device. The first lead frame is separated from the second lead frame by a predetermined distance. The thermal resistor is disposed in a clearance between the first lead frame and the second lead frame. The second semiconductor device controls to restrict operation of the first semiconductor device when the operational temperature of the first semiconductor device is higher than a predetermined temperature.
Public/Granted literature
- US07528469B2 Semiconductor equipment having multiple semiconductor devices and multiple lead frames Public/Granted day:2009-05-05
Information query
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