Invention Application
- Patent Title: Topographically defined thin film CPP read head fabrication
- Patent Title (中): 图形定位薄膜CPP读头制造
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Application No.: US10815447Application Date: 2004-03-31
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Publication No.: US20050227184A1Publication Date: 2005-10-13
- Inventor: David Heim , Kim Lee , Tsann Lin , Jih-Shiuan Luo
- Applicant: David Heim , Kim Lee , Tsann Lin , Jih-Shiuan Luo
- Assignee: HITACHI GLOBAL STORAGE TECHNOLOGIES
- Current Assignee: HITACHI GLOBAL STORAGE TECHNOLOGIES
- Main IPC: G11B5/127
- IPC: G11B5/127 ; G11B5/31
Abstract:
A method of constructing a small trackwidth magnetorsesistive sensor by defining a trench between first and second hard bias layers and depositing the sensor into the trench.
Public/Granted literature
- US07344330B2 Topographically defined thin film CPP read head fabrication Public/Granted day:2008-03-18
Information query
IPC分类:
