Invention Application
- Patent Title: Mold clamping apparatus and molding machine
- Patent Title (中): 模具夹紧装置和成型机
-
Application No.: US11091922Application Date: 2005-03-29
-
Publication No.: US20050226958A1Publication Date: 2005-10-13
- Inventor: Makoto Tsuji , Saburo Noda , Shinya Itani , Masaki Yashiro , Hiroshi Yokoyama
- Applicant: Makoto Tsuji , Saburo Noda , Shinya Itani , Masaki Yashiro , Hiroshi Yokoyama
- Applicant Address: JP Tokyo
- Assignee: TOSHIBA KIKAI KABUSHIKI KAISHA
- Current Assignee: TOSHIBA KIKAI KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Priority: JP2004-117968 20040413; JP2005-44365 20050221
- Main IPC: B22D17/26
- IPC: B22D17/26 ; B29C33/24 ; B29C45/66 ; B29C45/67 ; B29C45/76 ; B29C45/82

Abstract:
To provide a mold clamping apparatus able to suppress spout of a molding material from between mating faces of dies and to extend the lifetime of the dies. A mold clamping apparatus has a control apparatus deciding a distribution of a load divided by a plurality of tie bars based on information concerning to the die and controlling pressure of driving oil of a cylinder chamber of each cylinder for mold clamping independently to become a load having a determined distribution.
Public/Granted literature
- US07287972B2 Mold clamping apparatus and molding machine Public/Granted day:2007-10-30
Information query